ระบบไฟฟ้าเครื่องกลจุลภาค เกษรารัตน์ อักษรรัตน์ ภาควิชาฟิสิกส์อุตสาหกรรมและอุปกรณ์การแพทย์, คณะวิทยาศาสตร์ประยุกต์, มหาวิทยาลัยเทคโนโลยีพระจอมเกล้าพระนครเหนือ

Abstract
This article presents microelectromechanical systems (MEMS) that are mechanical part in micron level is drove by integrated circuit. Its structure consists of two principal components : a sensing or actuating element and a signal transconduction unit. The techniques used to fabricate MEMS are called micromachining. These are bulk micromachning ,surface micromachning and LiGA process. MEMS involve many materials for fabrication and packaging such as silicon, silicon compound, quartz, and GaAs etc. In MEMS packaging, not only are the sensing or actuation elements to be protect from a hostile environment, but they are also required to be in contact with environment to probe that environment the same time. MEMS products have become increasingly dominant in every aspect of commercial marketplace such as automotive industry, electronics industry, and health care industry etc.

Keywords: Microelectromechanical Systems (MEMS), Sensors, Actuators, Microsystems, Integrated circuit